Influences of additives on copper film quality and gap filling capability of plating process
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Main Authors: | Mridha, Shahjahan, Law, Shao Beng |
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Format: | Book Chapter |
Language: | English |
Published: |
IIUM Press
2011
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Subjects: | |
Online Access: | http://irep.iium.edu.my/19353/1/chp6.pdf http://irep.iium.edu.my/19353/ http://rms.research.iium.edu.my/bookstore/default.aspx |
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