Holdings: Influences of additives on copper film quality and gap filling capability of plating process

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Bibliographic Details
Main Authors:	Mridha, Shahjahan, Law, Shao Beng
Format:	Book Chapter
Language:	English
Published:	IIUM Press 2011
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://irep.iium.edu.my/19353/1/chp6.pdf http://irep.iium.edu.my/19353/ http://rms.research.iium.edu.my/bookstore/default.aspx
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