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Influences of additives on copper film quality and gap filling capability of plating process

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Main Authors: Mridha, Shahjahan, Law, Shao Beng
Format: Book Chapter
Language:English
Published: IIUM Press 2011
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://irep.iium.edu.my/19353/1/chp6.pdf
http://irep.iium.edu.my/19353/
http://rms.research.iium.edu.my/bookstore/default.aspx
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spelling my.iium.irep.193532012-09-05T00:19:04Z http://irep.iium.edu.my/19353/ Influences of additives on copper film quality and gap filling capability of plating process Mridha, Shahjahan Law, Shao Beng TJ Mechanical engineering and machinery IIUM Press 2011 Book Chapter REM application/pdf en http://irep.iium.edu.my/19353/1/chp6.pdf Mridha, Shahjahan and Law, Shao Beng (2011) Influences of additives on copper film quality and gap filling capability of plating process. In: Contemporary metallic materials. IIUM Press, Kuala Lumpur, pp. 34-40. ISBN 9789674181642 http://rms.research.iium.edu.my/bookstore/default.aspx
institution Universiti Islam Antarabangsa Malaysia
building IIUM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider International Islamic University Malaysia
content_source IIUM Repository (IREP)
url_provider http://irep.iium.edu.my/
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Mridha, Shahjahan
Law, Shao Beng
Influences of additives on copper film quality and gap filling capability of plating process
format Book Chapter
author Mridha, Shahjahan
Law, Shao Beng
author_facet Mridha, Shahjahan
Law, Shao Beng
author_sort Mridha, Shahjahan
title Influences of additives on copper film quality and gap filling capability of plating process
title_short Influences of additives on copper film quality and gap filling capability of plating process
title_full Influences of additives on copper film quality and gap filling capability of plating process
title_fullStr Influences of additives on copper film quality and gap filling capability of plating process
title_full_unstemmed Influences of additives on copper film quality and gap filling capability of plating process
title_sort influences of additives on copper film quality and gap filling capability of plating process
publisher IIUM Press
publishDate 2011
url http://irep.iium.edu.my/19353/1/chp6.pdf
http://irep.iium.edu.my/19353/
http://rms.research.iium.edu.my/bookstore/default.aspx
_version_ 1643607651965206528
score 13.209306

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