Thermal cooling of hot surfaces with fin heat sink, vapour chamber and thermoelectric
Saved in:
Main Author: | Tan, Choon Foong |
---|---|
Format: | Final Year Project / Dissertation / Thesis |
Published: |
2016
|
Subjects: | |
Online Access: | http://eprints.utar.edu.my/2943/1/Tan_Choon_Foong.pdf http://eprints.utar.edu.my/2943/ |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
An experimental study of PCM based finned and un-finned heat sinks for passive cooling of electronics
by: Usman, Hazrat, et al.
Published: (2018) -
Thermal Analysis of Staggered Pin Fin Heat Sink for Central Processing Unit
by: Mohd Annuar, Khalil Azha, et al.
Published: (2015) -
Thermal analysis of staggered pin fin heat sink for central processing unit
by: Mohd. Annuar, Khalil Azha, et al.
Published: (2015) -
Performance of thermoelectric cooling system: effect of aluminium heat sink and heat dissipation
by: Mohd Hafis, Sulaiman, et al.
Published: (2014) -
Heat Dissipation Enhancement Using Staggered Fin Heat Sink
by: Ong, Zi Hui
Published: (2022)