Inline pin fin heat sink model and thermal performance analysis for central processing unit

• Main Authors: Mohd Annuar, Khalil Azha, Ismail, Fatimah Sham, Harun, Mohamad Haniff, Mohd Ab Halim, Mohd Firdaus
• Format: Conference or Workshop Item
• Language: English
• Published: 2015
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.utem.edu.my/id/eprint/17503/1/p35_36.pdf; http://eprints.utem.edu.my/id/eprint/17503/

The thermal management issue hermal management issue is common in electronic products such as computers, projectors and others, The trend shows that by increasing the power density, indirectly it will increase the temperature anf power dissipation in CPU processor. This is a major challenge to the p...