Design and Development of Novel Fin Micro Channel Heat Sink for High Heat Flux Application
The scale-down trend increases the chips’ density and the high power handling capability generates unnecessary heat which can disrupt the reliability of the electronic devices. Therefore, various types of cooling solution have been proposed to enhance heat dissipation from electronic devices. One of...
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| Format: | Final Year Project / Dissertation / Thesis |
| Published: |
2019
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| Online Access: | http://eprints.utar.edu.my/3626/1/ESA%2D2019%2D1607629%2D1.pdf http://eprints.utar.edu.my/3626/ |
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