Thermal performance analysis for optimal passive cooling heat sink design

• Main Authors: Hisham, N. W. B., Ismail, F. S., Nawawi, M. A. A.
• Format: Article
• Language: English
• Published: Universitas Ahmad Dahlan 2017
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.utm.my/id/eprint/75638/1/NurWarissyahidahBadrulHisham_ThermalPerformanceAnalysisforOptimal.pdf; http://eprints.utm.my/id/eprint/75638/; https://www.scopus.com/inward/record.uri?eid=2-s2.0-85020235901&doi=10.12928%2fTELKOMNIKA.v15i2.6140&partnerID=40&md5=4a6bc8be7d08037ce19c9a6794d897e6

Recent advances in semiconductor technology show the improvement of fabrication on electronics appliances in terms of performance, power density and even the size. This great achievement however led to some major problems on thermal and heat distribution of the electronic devices. This thermal probl...