Effect of coating element on joining stability of Sn-0.3Ag-0.7Cu solder joint due to aging test
Solder joint is important for providing mechanical support and functionality of electronic packaging. Established solder joint should be able to withstand in device service operation and the environment without significant changes in terms of their microstructural evolution and mechanical properti...
Saved in:
Main Authors: | Atiqah Mohd Afdzaluddin,, Maria Abu Bakar, |
---|---|
Format: | Article |
Language: | English |
Published: |
Penerbit Universiti Kebangsaan Malaysia
2020
|
Online Access: | http://journalarticle.ukm.my/16167/1/14.pdf http://journalarticle.ukm.my/16167/ https://www.ukm.my/jsm/malay_journals/jilid49bil12_2020/KandunganJilid49Bil12_2020.html |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Effects of Co nanoparticle addition to Sn-3.8Ag-0.7Cu solder on interfacial structure after reflow and ageing
by: Haseeb, A.S. Md. Abdul, et al.
Published: (2011) -
Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition
by: Leong, Y.M., et al.
Published: (2016) -
Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures.
by: Ariff Syakirin, Ghazalli
Published: (2007) -
Corrosion properties of Cu/Sn-3.0Ag-0.5Cu/Cu solder butt joints fabricated by conventional reflow and microwave hybrid heating
by: Said, Mardiana, et al.
Published: (2022) -
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
by: Mohd Arif Anuar, Mohd Salleh, et al.
Published: (2022)