Effect of Particle Dispersion on Thermal Conductivity of Copper Powder Filled Epoxy Composites
The thermal conductivity of the epoxy can be enhanced by incorporating conductive particles. These materials have potential to be used as heat sink in electronic devices. This paper presents the results of developing copper powder reinforced epoxy composite and measurement of their thermal conductiv...
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| Main Authors: | , , , |
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| Format: | Book |
| Published: |
UPENA, UiTM
2007
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| Subjects: | |
| Online Access: | http://eprints.utp.edu.my/5902/1/GetabsServlet%3Fprog%3Dnormal%26id%3DAPCPCS001217000001000363000001%26idtype%3Dcvips%26gifs%3Dyes%26ref%3Dno http://eprints.utp.edu.my/5902/ |
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