Effect Of Particle Dispersion On Thermal Conductivity Of Copper Powder Filled Epoxy Composites
The thermal conductivity of the epoxy can be enhanced by incorporating conductive particles. These materials have the potential to be used as heat sink in electronic devices. This paper presents the results of developing copper powder reinforced epoxy composite and measurements of their thermal cond...
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| Main Authors: | , , , |
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| Format: | Article |
| Published: |
American Institute of Physics
2010
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| Subjects: | |
| Online Access: | http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=APCPCS001217000001000363000001&idtype=cvips&gifs=yes&ref=no http://eprints.utp.edu.my/5899/ |
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