Experimental preparation and numerical simulation of high thermal conductive Cu/CNTs Nanocomposites
Due to the rapid growth of high performance electronics devices accompanied by overheating problem, heat dissipater nanocomposites material having ultra-high thermal conductivity and low coefficient of thermal expansion was proposed. In this work, a nanocomposite material made of copper (Cu) reinfor...
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| Main Authors: | , , , , , |
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| Format: | Conference or Workshop Item |
| Published: |
EDP Sciences
2014
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84905020743&doi=10.1051%2fmatecconf%2f20141304028&partnerID=40&md5=a9ff594fd39f194813493fc4a4b1ff78 http://eprints.utp.edu.my/32232/ |
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