Experimental Preparation and Numerical Simulation of High Thermal Conductive Cu/CNTs Nanocomposites
Due to the rapid growth of high performance electronics devices accompanied by overheating problem, heat dissipater nanocomposites material having ultra-high thermal conductivity and low coefficient of thermal expansion was proposed. In this work, a nanocomposite material made of copper (Cu) reinfor...
Saved in:
| Main Author: | |
|---|---|
| Format: | Article |
| Published: |
2014
|
| Subjects: | |
| Online Access: | http://www.matec-conferences.org/articles/matecconf/abs/2014/04/matecconf_icper2014_04028/matecconf_icper2014_04028.html http://eprints.utp.edu.my/12130/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|