Experimental preparation and numerical simulation of high thermal conductive Cu/CNTs Nanocomposites
Due to the rapid growth of high performance electronics devices accompanied by overheating problem, heat dissipater nanocomposites material having ultra-high thermal conductivity and low coefficient of thermal expansion was proposed. In this work, a nanocomposite material made of copper (Cu) reinfor...
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my.utp.eprints.322322022-03-29T05:02:02Z Experimental preparation and numerical simulation of high thermal conductive Cu/CNTs Nanocomposites Muhsan, A.S. Ahmad, F. Mohamed, N.M. Yusoff, P.S.M.M. Raza, M.R. Afrooz, I.E. Due to the rapid growth of high performance electronics devices accompanied by overheating problem, heat dissipater nanocomposites material having ultra-high thermal conductivity and low coefficient of thermal expansion was proposed. In this work, a nanocomposite material made of copper (Cu) reinforced by multi-walled carbon nanotubes (CNTs) up to 10 vol. was prepared and their thermal behaviour was measured experimentally and evaluated using numerical simulation. In order to numerically predict the thermal behaviour of Cu/CNTs composites, three different prediction methods were performed. The results showed that rules of mixture method records the highest thermal conductivity for all predicted composites. In contrast, the prediction model which takes into account the influence of the interface thermal resistance between CNTs and copper particles, has shown the lowest thermal conductivity which considered as the closest results to the experimental measurement. The experimentally measured thermal conductivities showed remarkable increase after adding 5 vol. CNTs and higher than the thermal conductivities predicted via Nan models, indicating that the improved fabrication technique of powder injection molding that has been used to produced Cu/CNTs nanocomposites has overcome the challenges assumed in the mathematical models. © 2014 Owned by the authors, published by EDP Sciences. EDP Sciences 2014 Conference or Workshop Item NonPeerReviewed https://www.scopus.com/inward/record.uri?eid=2-s2.0-84905020743&doi=10.1051%2fmatecconf%2f20141304028&partnerID=40&md5=a9ff594fd39f194813493fc4a4b1ff78 Muhsan, A.S. and Ahmad, F. and Mohamed, N.M. and Yusoff, P.S.M.M. and Raza, M.R. and Afrooz, I.E. (2014) Experimental preparation and numerical simulation of high thermal conductive Cu/CNTs Nanocomposites. In: UNSPECIFIED. http://eprints.utp.edu.my/32232/ |
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Due to the rapid growth of high performance electronics devices accompanied by overheating problem, heat dissipater nanocomposites material having ultra-high thermal conductivity and low coefficient of thermal expansion was proposed. In this work, a nanocomposite material made of copper (Cu) reinforced by multi-walled carbon nanotubes (CNTs) up to 10 vol. was prepared and their thermal behaviour was measured experimentally and evaluated using numerical simulation. In order to numerically predict the thermal behaviour of Cu/CNTs composites, three different prediction methods were performed. The results showed that rules of mixture method records the highest thermal conductivity for all predicted composites. In contrast, the prediction model which takes into account the influence of the interface thermal resistance between CNTs and copper particles, has shown the lowest thermal conductivity which considered as the closest results to the experimental measurement. The experimentally measured thermal conductivities showed remarkable increase after adding 5 vol. CNTs and higher than the thermal conductivities predicted via Nan models, indicating that the improved fabrication technique of powder injection molding that has been used to produced Cu/CNTs nanocomposites has overcome the challenges assumed in the mathematical models. © 2014 Owned by the authors, published by EDP Sciences. |
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Conference or Workshop Item |
author |
Muhsan, A.S. Ahmad, F. Mohamed, N.M. Yusoff, P.S.M.M. Raza, M.R. Afrooz, I.E. |
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Muhsan, A.S. Ahmad, F. Mohamed, N.M. Yusoff, P.S.M.M. Raza, M.R. Afrooz, I.E. Experimental preparation and numerical simulation of high thermal conductive Cu/CNTs Nanocomposites |
author_facet |
Muhsan, A.S. Ahmad, F. Mohamed, N.M. Yusoff, P.S.M.M. Raza, M.R. Afrooz, I.E. |
author_sort |
Muhsan, A.S. |
title |
Experimental preparation and numerical simulation of high thermal conductive Cu/CNTs Nanocomposites |
title_short |
Experimental preparation and numerical simulation of high thermal conductive Cu/CNTs Nanocomposites |
title_full |
Experimental preparation and numerical simulation of high thermal conductive Cu/CNTs Nanocomposites |
title_fullStr |
Experimental preparation and numerical simulation of high thermal conductive Cu/CNTs Nanocomposites |
title_full_unstemmed |
Experimental preparation and numerical simulation of high thermal conductive Cu/CNTs Nanocomposites |
title_sort |
experimental preparation and numerical simulation of high thermal conductive cu/cnts nanocomposites |
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EDP Sciences |
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2014 |
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https://www.scopus.com/inward/record.uri?eid=2-s2.0-84905020743&doi=10.1051%2fmatecconf%2f20141304028&partnerID=40&md5=a9ff594fd39f194813493fc4a4b1ff78 http://eprints.utp.edu.my/32232/ |
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