Thermal-aware directional and adaptive routing algorithm for 3d network-on-chip

• Main Authors: Kaleem, Muhammad, Isnin, Ismail Fauzi
• Format: Article
• Language: English
• Published: Institute of Advanced Engineering and Science 2022
• Subjects: QA75 Electronic computers. Computer science
• Online Access: http://eprints.utm.my/id/eprint/98697/1/MuhammadKaleem2022_ThermalAwareDirectionalandAdaptive.pdf; http://eprints.utm.my/id/eprint/98697/; http://dx.doi.org/10.11591/ijeecs.v27.i2.pp1051-1061

Due to the tier architecture of 3D network-on-chip (3D-NoC), reducing the thermal hotspot within the chip is challenging as a cooling mechanism that lies merely on the single side of a chip. High power density in 3D NoC is responsible for reliability degradation and thermal difficulties. Thermal-awa...