Thermal-aware directional and adaptive routing algorithm for 3d network-on-chip
Due to the tier architecture of 3D network-on-chip (3D-NoC), reducing the thermal hotspot within the chip is challenging as a cooling mechanism that lies merely on the single side of a chip. High power density in 3D NoC is responsible for reliability degradation and thermal difficulties. Thermal-awa...
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Main Authors: | Kaleem, Muhammad, Isnin, Ismail Fauzi |
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Format: | Article |
Language: | English |
Published: |
Institute of Advanced Engineering and Science
2022
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Subjects: | |
Online Access: | http://eprints.utm.my/id/eprint/98697/1/MuhammadKaleem2022_ThermalAwareDirectionalandAdaptive.pdf http://eprints.utm.my/id/eprint/98697/ http://dx.doi.org/10.11591/ijeecs.v27.i2.pp1051-1061 |
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