The effects of the silicon wafer resistivity on the performance of microelectrical discharge machining
In this study, the performance of Si wafer machining by employing the die-sinking microelectrical discharge machining technique is reported. Specifically, the machining performance was examined on both high- (1–10 Ω cm) and low-resistivity (0.001–0.005 Ω cm) Si wafers by means of using a range of di...
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| Main Authors: | , , , |
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| Format: | Article |
| Published: |
Springer London
2018
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/86002/ http://dx.doi.org/10.1007/s00170-017-1190-4 |
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