Thermal model with metal consideration for System-On-Chip testing

• Main Authors: Abu Hassan, Hasliza, Ooi, Chia Yee
• 格式: Article
• 出版: American Scientific Publishers 2014
• 主题: T Technology
• 在线阅读: http://eprints.utm.my/id/eprint/63055/; http://dx.doi.org/10.1166/jolpe.2014.1330

Increasing switching activities leads to high temperature during testing, which has adverse impact on circuit performance and reliability. Therefore, simulating thermal effects on System-on-Chip (SoC) when performing test scheduling is essential. However, most of the previous works on temperatureawa...