The effects of nickel underlayer and solder dipping as tin whisker mitigations in tin surface finishes
Driven by environmental concerns and the enforcement of Restriction of Hazardous Substances Directive (RoHS) to ban the use of lead in electronics, the global electronics industry has migrated toward lead-free electronics. However, the adoption of lead-free tin (Sn) surface finish is known to form w...
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| Main Authors: | , , |
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| Format: | Article |
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Trans Tech Publication
2014
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/62910/ http://dx.doi.org/10.4028/www.scientific.net/AMM.554.47 |
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