Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers
The changes of microstructure in pure-Sn after deformation were investigated by electron microscopy. Two types of specimens were prepared: Sample-1; pure-Sn/Fe-42Ni, Sample-2; single crystalline pure-Sn. The growth of curling whiskers on Sample-1 was observed in-situ in a scanning electron microscop...
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| Main Authors: | , , |
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| Format: | Article |
| Published: |
Trans Tech Publications Ltd.
2015
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/59248/ http://www.dx.doi.org/10.4028/www.scientific.net/MSF.827.341 |
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