A review of computational damage mechanics of mass transport in solder joint

• Main Authors: Hamid, M. F. A., Tamin, M. N.
• Format: Conference or Workshop Item
• Published: 2015
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/59117/; http://dx.doi.org/10.1109/IEMT.2014.7123121

Motivated by the requirement of International Technology Roadmap for Semiconductors (ITRS), this article addresses ITRS modelling and simulation requirements particularly electromigration and thermomigration. The governing equations, material and damage mechanics models are discussed, finite element...