A review of computational damage mechanics of mass transport in solder joint
Motivated by the requirement of International Technology Roadmap for Semiconductors (ITRS), this article addresses ITRS modelling and simulation requirements particularly electromigration and thermomigration. The governing equations, material and damage mechanics models are discussed, finite element...
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2015
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| Online Access: | http://eprints.utm.my/id/eprint/59117/ http://dx.doi.org/10.1109/IEMT.2014.7123121 |
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my.utm.591172022-04-05T06:26:15Z http://eprints.utm.my/id/eprint/59117/ A review of computational damage mechanics of mass transport in solder joint Hamid, M. F. A. Tamin, M. N. TJ Mechanical engineering and machinery Motivated by the requirement of International Technology Roadmap for Semiconductors (ITRS), this article addresses ITRS modelling and simulation requirements particularly electromigration and thermomigration. The governing equations, material and damage mechanics models are discussed, finite element formulations are developed, and finally results from simulations and experiments are compared to validate simulation results. 2015 Conference or Workshop Item PeerReviewed Hamid, M. F. A. and Tamin, M. N. (2015) A review of computational damage mechanics of mass transport in solder joint. In: 2014 36th IEEE International Electronics Manufacturing Technology Conference, IEMT 2014, 11 - 13 November 2014, Johor, Malaysia. http://dx.doi.org/10.1109/IEMT.2014.7123121 |
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Universiti Teknologi Malaysia |
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TJ Mechanical engineering and machinery |
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TJ Mechanical engineering and machinery Hamid, M. F. A. Tamin, M. N. A review of computational damage mechanics of mass transport in solder joint |
| description |
Motivated by the requirement of International Technology Roadmap for Semiconductors (ITRS), this article addresses ITRS modelling and simulation requirements particularly electromigration and thermomigration. The governing equations, material and damage mechanics models are discussed, finite element formulations are developed, and finally results from simulations and experiments are compared to validate simulation results. |
| format |
Conference or Workshop Item |
| author |
Hamid, M. F. A. Tamin, M. N. |
| author_facet |
Hamid, M. F. A. Tamin, M. N. |
| author_sort |
Hamid, M. F. A. |
| title |
A review of computational damage mechanics of mass transport in solder joint |
| title_short |
A review of computational damage mechanics of mass transport in solder joint |
| title_full |
A review of computational damage mechanics of mass transport in solder joint |
| title_fullStr |
A review of computational damage mechanics of mass transport in solder joint |
| title_full_unstemmed |
A review of computational damage mechanics of mass transport in solder joint |
| title_sort |
review of computational damage mechanics of mass transport in solder joint |
| publishDate |
2015 |
| url |
http://eprints.utm.my/id/eprint/59117/ http://dx.doi.org/10.1109/IEMT.2014.7123121 |
| _version_ |
1729703238537576448 |
| score |
13.211869 |