A review of computational damage mechanics of mass transport in solder joint
Motivated by the requirement of International Technology Roadmap for Semiconductors (ITRS), this article addresses ITRS modelling and simulation requirements particularly electromigration and thermomigration. The governing equations, material and damage mechanics models are discussed, finite element...
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| Main Authors: | , |
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| Format: | Conference or Workshop Item |
| Published: |
2015
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/59117/ http://dx.doi.org/10.1109/IEMT.2014.7123121 |
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| Summary: | Motivated by the requirement of International Technology Roadmap for Semiconductors (ITRS), this article addresses ITRS modelling and simulation requirements particularly electromigration and thermomigration. The governing equations, material and damage mechanics models are discussed, finite element formulations are developed, and finally results from simulations and experiments are compared to validate simulation results. |
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