Effect of reflow profile on intermetallic compound formation

• Main Authors: Idris, Siti Rabiatull Aisha, Ourdjini, Ali, Mohamed Ariff, Azmah Hanim, Osman, Saliza Azlina
• Format: Conference or Workshop Item
• Language: English
• Published: 2013
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/51021/1/SitiRabiatulAisha2013_EffectofReflowProfileonIntermetallicCompoundFormation.pdf; http://eprints.utm.my/id/eprint/51021/

Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. So f...