Effect of Reflow Profile on Intermetallic Compound Formation
Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. So f...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English English |
| Published: |
IOP Publishing
2013
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/3549/1/169_Siti_Rabiatull_Aisha_Idris_MOIME2013.pdf http://umpir.ump.edu.my/id/eprint/3549/2/1757-899X_46_1_012037_2.pdf http://umpir.ump.edu.my/id/eprint/3549/ http://dx.doi.org/10.1016/j.clnme.2012.05.002 |
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