Effect of isothermal aging 2000 hours on intermetallics formed between ni-pd-au with sn-4ag-0.5cu solders

• Main Authors: Mohamed Ariff, Azmah Hanim, Ourdjini, Ali, Idris, Siti Rabiatul Aisha, Osman, Saliza Azlina
• Format: Conference or Workshop Item
• Published: 2013
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/51017/; http://dx.doi.org/10.4028/www.scientific.net/AMR.650.194

The present study investigated the effect of isothermal aging up to 2000 hours on the intermetallics formed between Sn-4Ag-0.5Cu lead free solder on electroless nickel electroless palladium immersion gold surface finish (Ni-Pd-Au). For all parameters, aging have an effect of changing the intermetall...