Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish

• المؤلف الرئيسي: Tai, Siew Fong
• التنسيق: أطروحة
• اللغة: English
• منشور في: 2003
• الموضوعات: TJ Mechanical engineering and machinery
• الوصول للمادة أونلاين: http://eprints.utm.my/id/eprint/4392/1/TaiSiewFongMFKM2003.pdf; http://eprints.utm.my/id/eprint/4392/

In flip chip interconnection an under bump metallurgy (UBM) is required to provide a diffusion barrier, an adhesion and a solderable surface. Among the various UBM systems available the electroless nickel / immersion gold (ENIG) has received greater attention in recent years due to its low cost and...