A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials

• Main Authors: Mohd. Yusof, Ab. Aziz, Mohd. Szali Januddi, Mohd. Al Fatihhi, Harun, Muhamad Noor
• Format: Article
• Language: English
• Published: Ain Shams University 2022
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/100758/1/MuhamadNoorHarun2022_AStudyofMicroScaleSolderBumpGeometricShapes.pdf; http://eprints.utm.my/id/eprint/100758/; http://dx.doi.org/10.1016/j.asej.2022.101769

Demand for more interconnection joints between semiconductor devices can be realized with solder bump technology. Surface tension and density are usually material properties related factors that affect solder bump geometric shape. Therefore, to cope with this fast-changing microarchitecture design i...