Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
Solder bump bridging (SBB) is a type microprocessor packaging defects in Flip-Chip or C4 interconnection layer. The presence of micro conductive contaminate particle in die-package layer which causes bridging between two or more adjacent solder bump. These contaminate particles are mainly comes from...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2017
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| Subjects: | |
| Online Access: | http://eprints.usm.my/39584/1/LOO_KEAN_ANN_24_Pages.pdf http://eprints.usm.my/39584/ |
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