Solder bump strength and failure mode of low-k flip chip device

In this paper, the failure mode and solder bump strength for low-k flip chip devices were determined using die pull technique. The results show there is no significant difference between low-k and non low-k devices in terms of bumps strength for the amount of taffy in this device. However, there is...

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Bibliographic Details
Main Authors: Endut, Z., Ahmad, I., Swee, G.L.H., Sukemi, N.M.
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Published: 2017
Online Access:http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5305
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