Influence of Wafer Probing Against Initial Bonding

• Main Authors: Suresh, Kumar, Sivarao, Subramonian, Guan, Tan Kim, Harun, Fuaida
• Format: Article
• Language: English
• Published: 2010
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utem.edu.my/id/eprint/9306/1/Influence_of_Wafer_Probing_Against_Initial_Bonding.pdf; http://eprints.utem.edu.my/id/eprint/9306/

Wafer probing technology is a critical testing technology used in the semiconductor manufacturing and packaging process. A well-designed probing system must enable low and stable contact resistance when each needle-like probe makes contact with the IC chip-bonding pad. During wafer testing, probe ne...