A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress
Interconnection material is a important element in the industry. This study is investigate the effect of different interconnection materials on ball bond strength and study the effect of temperature cycling stress test on the ball bond strength. The literature review is based on comprehensive l...
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| フォーマット: | Conference or Workshop Item |
| 言語: | English |
| 出版事項: |
2012
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| オンライン･アクセス: | http://eprints.utem.edu.my/id/eprint/7055/1/Proceedings_of_iDECON_2012_238_245.pdf http://eprints.utem.edu.my/id/eprint/7055/ |
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