A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress
Interconnection material is a important element in the industry. This study is investigate the effect of different interconnection materials on ball bond strength and study the effect of temperature cycling stress test on the ball bond strength. The literature review is based on comprehensive l...
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| Main Author: | |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/7055/1/Proceedings_of_iDECON_2012_238_245.pdf http://eprints.utem.edu.my/id/eprint/7055/ |
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| Summary: | Interconnection material is a important element in
the industry. This study is investigate the effect of different
interconnection materials on ball bond strength and study the
effect of temperature cycling stress test on the ball bond
strength. The literature review is based on comprehensive
literature review from previous study. The strength on different
interconnection materials of wire (gold and aluminum) and
bond pad (copper and aluminum) after temperature cycle is
investigated by using DMAIC methodology. The study is started
with the reliability test with various Temperature Cycle (TC)
stress and Failure Analysis testing was carried out to collect the
wire pull strength value and ball shear strength value of
different device. |
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