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A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress

Interconnection material is a important element in the industry. This study is investigate the effect of different interconnection materials on ball bond strength and study the effect of temperature cycling stress test on the ball bond strength. The literature review is based on comprehensive l...

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Bibliographic Details
Main Author: A. P., Puvanasvaran
Format: Conference or Workshop Item
Language:English
Published: 2012
Subjects:
HD28 Management. Industrial Management
Online Access:http://eprints.utem.edu.my/id/eprint/7055/1/Proceedings_of_iDECON_2012_238_245.pdf
http://eprints.utem.edu.my/id/eprint/7055/
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spelling my.utem.eprints.70552015-05-28T03:46:47Z http://eprints.utem.edu.my/id/eprint/7055/ A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress A. P., Puvanasvaran HD28 Management. Industrial Management Interconnection material is a important element in the industry. This study is investigate the effect of different interconnection materials on ball bond strength and study the effect of temperature cycling stress test on the ball bond strength. The literature review is based on comprehensive literature review from previous study. The strength on different interconnection materials of wire (gold and aluminum) and bond pad (copper and aluminum) after temperature cycle is investigated by using DMAIC methodology. The study is started with the reliability test with various Temperature Cycle (TC) stress and Failure Analysis testing was carried out to collect the wire pull strength value and ball shear strength value of different device. 2012 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.utem.edu.my/id/eprint/7055/1/Proceedings_of_iDECON_2012_238_245.pdf A. P., Puvanasvaran (2012) A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress. In: iDECON 2012 – International Conference on Design and Concurrent Engineering, 15 - 16 October 2012, Melaka.
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
topic HD28 Management. Industrial Management
spellingShingle HD28 Management. Industrial Management
A. P., Puvanasvaran
A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress
description Interconnection material is a important element in the industry. This study is investigate the effect of different interconnection materials on ball bond strength and study the effect of temperature cycling stress test on the ball bond strength. The literature review is based on comprehensive literature review from previous study. The strength on different interconnection materials of wire (gold and aluminum) and bond pad (copper and aluminum) after temperature cycle is investigated by using DMAIC methodology. The study is started with the reliability test with various Temperature Cycle (TC) stress and Failure Analysis testing was carried out to collect the wire pull strength value and ball shear strength value of different device.
format Conference or Workshop Item
author A. P., Puvanasvaran
author_facet A. P., Puvanasvaran
author_sort A. P., Puvanasvaran
title A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress
title_short A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress
title_full A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress
title_fullStr A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress
title_full_unstemmed A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress
title_sort study on the effect of different interconnection materials (wire and bond pad) on ball bond strength after temperature cycle stress
publishDate 2012
url http://eprints.utem.edu.my/id/eprint/7055/1/Proceedings_of_iDECON_2012_238_245.pdf
http://eprints.utem.edu.my/id/eprint/7055/
_version_ 1665905342536482816
score 13.149126

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