A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress
Interconnection material is a important element in the industry. This study is investigate the effect of different interconnection materials on ball bond strength and study the effect of temperature cycling stress test on the ball bond strength. The literature review is based on comprehensive l...
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2012
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在线阅读: | http://eprints.utem.edu.my/id/eprint/7055/1/Proceedings_of_iDECON_2012_238_245.pdf http://eprints.utem.edu.my/id/eprint/7055/ |
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my.utem.eprints.70552015-05-28T03:46:47Z http://eprints.utem.edu.my/id/eprint/7055/ A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress A. P., Puvanasvaran HD28 Management. Industrial Management Interconnection material is a important element in the industry. This study is investigate the effect of different interconnection materials on ball bond strength and study the effect of temperature cycling stress test on the ball bond strength. The literature review is based on comprehensive literature review from previous study. The strength on different interconnection materials of wire (gold and aluminum) and bond pad (copper and aluminum) after temperature cycle is investigated by using DMAIC methodology. The study is started with the reliability test with various Temperature Cycle (TC) stress and Failure Analysis testing was carried out to collect the wire pull strength value and ball shear strength value of different device. 2012 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.utem.edu.my/id/eprint/7055/1/Proceedings_of_iDECON_2012_238_245.pdf A. P., Puvanasvaran (2012) A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress. In: iDECON 2012 – International Conference on Design and Concurrent Engineering, 15 - 16 October 2012, Melaka. |
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HD28 Management. Industrial Management A. P., Puvanasvaran A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress |
description |
Interconnection material is a important element in
the industry. This study is investigate the effect of different
interconnection materials on ball bond strength and study the
effect of temperature cycling stress test on the ball bond
strength. The literature review is based on comprehensive
literature review from previous study. The strength on different
interconnection materials of wire (gold and aluminum) and
bond pad (copper and aluminum) after temperature cycle is
investigated by using DMAIC methodology. The study is started
with the reliability test with various Temperature Cycle (TC)
stress and Failure Analysis testing was carried out to collect the
wire pull strength value and ball shear strength value of
different device. |
format |
Conference or Workshop Item |
author |
A. P., Puvanasvaran |
author_facet |
A. P., Puvanasvaran |
author_sort |
A. P., Puvanasvaran |
title |
A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on
Ball Bond Strength after Temperature Cycle Stress |
title_short |
A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on
Ball Bond Strength after Temperature Cycle Stress |
title_full |
A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on
Ball Bond Strength after Temperature Cycle Stress |
title_fullStr |
A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on
Ball Bond Strength after Temperature Cycle Stress |
title_full_unstemmed |
A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on
Ball Bond Strength after Temperature Cycle Stress |
title_sort |
study on the effect of different interconnection materials (wire and bond pad) on
ball bond strength after temperature cycle stress |
publishDate |
2012 |
url |
http://eprints.utem.edu.my/id/eprint/7055/1/Proceedings_of_iDECON_2012_238_245.pdf http://eprints.utem.edu.my/id/eprint/7055/ |
_version_ |
1665905342536482816 |
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13.149126 |