Microstructural studies of Cu-Al Intermetallic Compound at Thermosonic Wire Bonding Interface

• Main Authors: Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Abd Rashid, Mohd Warikh, Hng, May Ting, Lee, Cher Chia
• Format: Conference or Workshop Item
• Language: English
• Published: 2012
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utem.edu.my/id/eprint/6959/1/idecon2012_Anand_105.pdf; http://eprints.utem.edu.my/id/eprint/6959/; http://idecon.utem.edu.my/

Cu-Al intermetallic compound (IMC) in Cu wire-Al bond pad bonding interface has been an area of interest for researchers. In this paper, characterization of IMC at bonding interface of annealed diode micro-chip has been performed using Scanning Electron Microscope (SEM), Transmission Electron Micros...