A DFT technique for electrical interconnect testing of circuit boards with 3D Stacked SRAM ICs

• Main Authors: Ikiri, Yuki, Yotsuyanagi, Hiroyuki, Ali, Fara Ashikin, Lu, Shyue-Kung, Hashizume, Masaki
• Format: Conference or Workshop Item
• Language: English
• Published: 2023
• Online Access: http://eprints.utem.edu.my/id/eprint/28088/1/A%20DfT%20technique%20for%20electrical%20interconnect%20testing%20of%20circuit%20boards%20with%203D%20Stacked%20SRAM%20ICs.pdf; http://eprints.utem.edu.my/id/eprint/28088/; https://ieeexplore.ieee.org/document/10339543

A Design-for-test (DfT) technique is proposed in this paper for a test method, by which detecting open defects occurring interconnects between 3D stacked SRAM IC and a printed circuit board and among dies inside them. The test method is based on the supply current that is made flow through an...