Design, optimization, fabrication and analysis of Cu microheater for loop-mediated isothermal amplification (LAMP) applications

A paper presents the design, fabrication, and thermal evaluation of a printed circuit board (PCB) based copper (Cu) microheater that can be integrated with microfluidic chips to initiate the loop-mediated isothermal amplification (LAMP). A series of 3D finite element electro-thermal simulations were...

Full description

Saved in:
Bibliographic Details
Main Authors: Narayanamurthy, Vigneswaran, Samsuri, Fahmi, Jeroish, Z. E., Shankar, Abhishek Futane, Shanmugavel, Bhuvaneshwari Kumaravel
Format: Article
Language:English
Published: Elsevier Ltd. 2023
Online Access:http://eprints.utem.edu.my/id/eprint/27124/2/0263102012024670.PDF
http://eprints.utem.edu.my/id/eprint/27124/
https://pdf.sciencedirectassets.com/311226/1-s2.0-S2352492823X00038/1-s2.0-S2352492823013545/main.pdf?X-Amz-Security-Token=IQoJb3JpZ2luX2VjENb%2F%2F%2F%2F%2F%2F%2F%2F%2F%2FwEaCXVzLWVhc3QtMSJHMEUCIQDphS%2FDG89nQgtlc9jJ%2FZa5IFPLa2SF6w7kKvEOsxDuDAIgO4XHnBs7B8xSSVRlgdxNCrDSQQlDf6ivPda%2FnD3whvYqswUIbhAFGgwwNTkwMDM1NDY4NjUiDMDJvgqAZlBC069xlyqQBT3doIeS%2Fpdo9y79MCbFsG%2F%2BVuZQyifiL9cdhn%2FsftoGLxcYGBdjOPC1hlWy4%2BfFRlPdr5sdABzagHyhCwd%2FjE0QSqxy%2BjQomqZa4Byb1g700nS0iPM%2BMjWFOE2qyDBxee%2FkBr6rRJ7LBhUZh%2BNmDascSvOutMv85iPZgh1eV8NDJMACF%2Fr2H%2Bru8wJMr1t1uCjbrztWr%2BlqtM6Wizsq9GTnkp05sNJdVMkplsFhhBlb3Ds5gSwQ7BHI9LnNjBxHrzZwGX6VcG%2B0HqJnMqIREndFwDMHH8nthSHEH%2B95oKUULPxAiQub8RiJxe6EfY8yhy1tX9Kb4joOPn92B%2BmvdcKd9EIZ80jg2VJ7XBvsIrWN4H4YVum%2Fg7xnQA3%2FbZN3rt1J7VP9frcBb4ge1WjbarCYhPt4N5hQ3SWaLMy55NE6%2FeDg92EIcFTgav%2F6a4C1sJl18hy72%2F0stmO%2Fnit2djf%2B9woCSW7p9kxD%2B24xUE5eiRb90QRcZbwIE1gTmaPAGRxRHjHP0%2BwtxgaJW5DVdcxhBXeKqpdFGVWOflCq3ozvYRzATQDAmRMmL0lxfG78JmG7zS7R1%2BDveSQos3Im2OFSrUmwtONo7U0NF5q%2BwfDC4w1y0443%2BahKb1XrmHI631U8HDTXGxwcHsnKirJp4Fhnpsy5QXYvDDOsvB4wW%2BkYdLfPJLhl6gI65r%2BWBkXEC8MkOsUfMHMUHpr2Q2buI50rx9p0Wy5ox1Iek6nj2yX3G0fKEU1mzoBR7XcEsLuo2jhvnNClAHW0%2BjHJ%2Ff8zj9i7491yD%2FcnzqcF3oUQHsuDNZ1H2wkUW2JkYO6yRmYMrScimdxaS3jT4IG%2BHaUi2sbzEPm19bc9I%2BUZYPbD0lp%2FMKz82KwGOrEBxB4GH1P9tGcVLbms2mM68vWTEzyox0yoAiKjiUZsWXbDxwUhec908BbslesXjZ7%2BhDtRsRwxUzFGxsRtBS7Q1Gz1wgvBPpUi9kEE4zHJlyBut6gBrSrVRiTw%2BXYImmoyhKf9HzsdQmRT30LYKAFBLVsPNCWNRmAL3f73xT2AYqaMkyCueYnSEhg7T4qf3kpF7uYYuT%2FCUuk040x5wfD9Jq9RgLn6TAbaHyp3224edX7g&X-Amz-Algorithm=AWS4-HMAC-SHA256&X-Amz-Date=20240104T064231Z&X-Amz-SignedHeaders=host&X-Amz-Expires=300&X-Amz-Credential=ASIAQ3PHCVTYWEQ2ZUWK%2F20240104%2Fus-east-1%2Fs3%2Faws4_request&X-Amz-Signature=64c1239ff9a9be9ee6814b3dd1e2b31ff4f321a327b677c7e1065b879d3dd3dc&hash=01ae1016af92b1a2625fca7752ecb65e8fbaaa95afd1c87fb381e73114201a1c&host=68042c943591013ac2b2430a89b270f6af2c76d8dfd086a07176afe7c76c2c61&pii=S2352492823013545&tid=spdf-d8f46f82-8cc4-4096-98bc-07bdb693b7a7&sid=2d3bf3cc6c601344751965717eb5efbad1abgxrqb&type=client&tsoh=d3d3LnNjaWVuY2VkaXJlY3QuY29t&ua=031c57525e5f57555c&rr=840180836eac13db&cc=my
https://doi.org/10.1016/j.mtcomm.2023.106663
Tags: Add Tag
No Tags, Be the first to tag this record!

Similar Items