The evolutions of microstructure in pressureless sintered silver die attach material
Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure evolutions of Ag particles under pressureless sintering in a polymeric a...
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Main Authors: | , , , , |
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Format: | Article |
Language: | English |
Published: |
Universiti Malaysia Perlis
2021
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Online Access: | http://eprints.utem.edu.my/id/eprint/25742/2/IJNEAM2021015_THE%20EVOLUTION%20OF%20MICROSTRUCTURE%20IN%20PRESSURELESS%20SINTERED%20SILVER%20DIE%20ATTACH%20MATERIALS.PDF http://eprints.utem.edu.my/id/eprint/25742/ https://ijneam.unimap.edu.my/images/PDF/IJNEAM-%20Regular%20Issue%20APRIL%202021%20pdf/IJNEAM2021015_Final_pr_Verified%20(1).pdf |
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