The evolutions of microstructure in pressureless sintered silver die attach material
Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure evolutions of Ag particles under pressureless sintering in a polymeric a...
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Universiti Malaysia Perlis
2021
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Online Access: | http://eprints.utem.edu.my/id/eprint/25742/2/IJNEAM2021015_THE%20EVOLUTION%20OF%20MICROSTRUCTURE%20IN%20PRESSURELESS%20SINTERED%20SILVER%20DIE%20ATTACH%20MATERIALS.PDF http://eprints.utem.edu.my/id/eprint/25742/ https://ijneam.unimap.edu.my/images/PDF/IJNEAM-%20Regular%20Issue%20APRIL%202021%20pdf/IJNEAM2021015_Final_pr_Verified%20(1).pdf |
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my.utem.eprints.257422023-07-20T15:43:56Z http://eprints.utem.edu.my/id/eprint/25742/ The evolutions of microstructure in pressureless sintered silver die attach material Omar, Ghazali Esa, Siti Rahmah Sheikh Md Fadzullah, Siti Hajar Siow, Kim Shyong Abdul Rahim, Bazura Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure evolutions of Ag particles under pressureless sintering in a polymeric adhesive binder at 200 °C, 250 °C, 275 °C, and 300 °C for a duration of 2 hours. The grains, particles, and neck growth observed via two-dimensional Focused Ion Beam (FIB) cuts on the samples at different sintering temperatures were associated with the atomic motions and reduction of surface energy that is the driving force for sintering. In this study, the pressureless sintering process in a polymeric adhesive binder successfully transformed the scattered Ag particles into a compact and dense Ag joining at 300 °C. The electrical conductivity value obtained at 300 °C was 5.2E+05 S/cm, which was the highest among the evaluation samples. Universiti Malaysia Perlis 2021-04 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/25742/2/IJNEAM2021015_THE%20EVOLUTION%20OF%20MICROSTRUCTURE%20IN%20PRESSURELESS%20SINTERED%20SILVER%20DIE%20ATTACH%20MATERIALS.PDF Omar, Ghazali and Esa, Siti Rahmah and Sheikh Md Fadzullah, Siti Hajar and Siow, Kim Shyong and Abdul Rahim, Bazura (2021) The evolutions of microstructure in pressureless sintered silver die attach material. International Journal of Nanoelectronics and Materials, 14 (2). pp. 179-194. ISSN 1985-5761 https://ijneam.unimap.edu.my/images/PDF/IJNEAM-%20Regular%20Issue%20APRIL%202021%20pdf/IJNEAM2021015_Final_pr_Verified%20(1).pdf |
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Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure evolutions of Ag particles under pressureless sintering in a polymeric adhesive binder at 200 °C, 250 °C, 275 °C, and 300 °C for a duration of 2 hours. The grains, particles, and neck growth observed via two-dimensional Focused Ion Beam (FIB) cuts on the samples at different sintering temperatures were associated with the atomic motions and reduction of surface energy that is the driving force for sintering. In this study, the pressureless sintering process in a polymeric adhesive binder successfully transformed the scattered Ag particles into a compact and dense Ag
joining at 300 °C. The electrical conductivity value obtained at 300 °C was 5.2E+05 S/cm, which was the highest among the evaluation samples. |
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Article |
author |
Omar, Ghazali Esa, Siti Rahmah Sheikh Md Fadzullah, Siti Hajar Siow, Kim Shyong Abdul Rahim, Bazura |
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Omar, Ghazali Esa, Siti Rahmah Sheikh Md Fadzullah, Siti Hajar Siow, Kim Shyong Abdul Rahim, Bazura The evolutions of microstructure in pressureless sintered silver die attach material |
author_facet |
Omar, Ghazali Esa, Siti Rahmah Sheikh Md Fadzullah, Siti Hajar Siow, Kim Shyong Abdul Rahim, Bazura |
author_sort |
Omar, Ghazali |
title |
The evolutions of microstructure in pressureless sintered silver die attach material |
title_short |
The evolutions of microstructure in pressureless sintered silver die attach material |
title_full |
The evolutions of microstructure in pressureless sintered silver die attach material |
title_fullStr |
The evolutions of microstructure in pressureless sintered silver die attach material |
title_full_unstemmed |
The evolutions of microstructure in pressureless sintered silver die attach material |
title_sort |
evolutions of microstructure in pressureless sintered silver die attach material |
publisher |
Universiti Malaysia Perlis |
publishDate |
2021 |
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http://eprints.utem.edu.my/id/eprint/25742/2/IJNEAM2021015_THE%20EVOLUTION%20OF%20MICROSTRUCTURE%20IN%20PRESSURELESS%20SINTERED%20SILVER%20DIE%20ATTACH%20MATERIALS.PDF http://eprints.utem.edu.my/id/eprint/25742/ https://ijneam.unimap.edu.my/images/PDF/IJNEAM-%20Regular%20Issue%20APRIL%202021%20pdf/IJNEAM2021015_Final_pr_Verified%20(1).pdf |
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