Bonding Material Enhancement For Surface Mount Component On Plastic Assembly
This project is about formulating and characterizing the electrically conductive adhesive (ECA) as eco-friendly, lead-free interconnect materials. This project aims to identify an optimum formulation of the ECA when using epoxy as a matrix with multiwalled carbon nanotube (MWCNT) as the conductive f...
Saved in:
Main Authors: | Sheikh Md. Fadzullah, Siti Hajar, Omar, Ghazali, Mustafa, Zaleha, Hasan, Rafidah, Mohd Noh, Mohd Syahrin Amri, Wu, Jonathan, Samsudin, Zambri |
---|---|
Format: | Technical Report |
Language: | English |
Published: |
UTeM
2019
|
Online Access: | http://eprints.utem.edu.my/id/eprint/25482/1/Bonding%20Material%20Enhancement%20For%20Surface%20Mount%20Component%20On%20Plastic%20Assembly.pdf http://eprints.utem.edu.my/id/eprint/25482/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=118469 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA)
by: Noor Mariamadzliza, Mohd Nan, et al.
Published: (2009) -
Failure assessment of surface mount assembly under thermomechanical loading conditions
by: Liew, Yek Ban
Published: (2006) -
Solder joint fatigue in a surface mount assembly subjected to mechanical loading
by: Tamin, M. N., et al.
Published: (2007) -
Solder joint fatigue in a surface-mount assembly subjected to mechanical loading
by: Tamin, M. N., et al.
Published: (2005) -
Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process
by: Ali Mokhtar, Mohd Najib, et al.
Published: (2018)