Bonding Material Enhancement For Surface Mount Component On Plastic Assembly

• Main Authors: Sheikh Md. Fadzullah, Siti Hajar, Omar, Ghazali, Mustafa, Zaleha, Hasan, Rafidah, Mohd Noh, Mohd Syahrin Amri, Wu, Jonathan, Samsudin, Zambri
• Format: Technical Report
• Language: English
• Published: UTeM 2019
• Online Access: http://eprints.utem.edu.my/id/eprint/25482/1/Bonding%20Material%20Enhancement%20For%20Surface%20Mount%20Component%20On%20Plastic%20Assembly.pdf; http://eprints.utem.edu.my/id/eprint/25482/; https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=118469

This project is about formulating and characterizing the electrically conductive adhesive (ECA) as eco-friendly, lead-free interconnect materials. This project aims to identify an optimum formulation of the ECA when using epoxy as a matrix with multiwalled carbon nanotube (MWCNT) as the conductive filler (with two different length), in the range of 5 to 12 wt.%. and also its optimum composition to enhance join strength while not compromising its main functional property, that is as electrically conductive adhesive.