Bonding Material Enhancement For Surface Mount Component On Plastic Assembly
This project is about formulating and characterizing the electrically conductive adhesive (ECA) as eco-friendly, lead-free interconnect materials. This project aims to identify an optimum formulation of the ECA when using epoxy as a matrix with multiwalled carbon nanotube (MWCNT) as the conductive f...
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| Main Authors: | , , , , , , |
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| Format: | Technical Report |
| Language: | English |
| Published: |
UTeM
2019
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| Online Access: | http://eprints.utem.edu.my/id/eprint/25482/1/Bonding%20Material%20Enhancement%20For%20Surface%20Mount%20Component%20On%20Plastic%20Assembly.pdf http://eprints.utem.edu.my/id/eprint/25482/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=118469 |
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| Summary: | This project is about formulating and characterizing the electrically conductive adhesive (ECA) as eco-friendly, lead-free interconnect materials. This project aims to identify an optimum formulation of the ECA when using epoxy as a matrix with multiwalled carbon nanotube (MWCNT) as the conductive filler (with two different length), in the range of 5 to 12 wt.%. and also its optimum composition to enhance join strength while not compromising its main functional property, that is as electrically conductive adhesive. |
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