Characterisation Of Sheet Resistivity And Contact Resistivity For Source/Drain Of N-Mosfet Device

In this study, the sheet resistivity (ps) of the thin film phosphorus ion source/drain implantation regions, and the specific interfacial contact resistivity (pc) between the thin film aluminium 1% silicon electrode layer and the thin film phosphorus ion source/drain implantation regions of the n-ch...

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Main Author: Rhonira, Latif
Format: Article
Language:English
Published: Penerbit Universiti, UTeM 2014
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Online Access:http://eprints.utem.edu.my/id/eprint/16843/2/JTEC2014.pdf
http://eprints.utem.edu.my/id/eprint/16843/
http://journal.utem.edu.my/index.php/jtec/article/view/464
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spelling my.utem.eprints.168432021-09-05T17:36:21Z http://eprints.utem.edu.my/id/eprint/16843/ Characterisation Of Sheet Resistivity And Contact Resistivity For Source/Drain Of N-Mosfet Device Rhonira, Latif T Technology (General) In this study, the sheet resistivity (ps) of the thin film phosphorus ion source/drain implantation regions, and the specific interfacial contact resistivity (pc) between the thin film aluminium 1% silicon electrode layer and the thin film phosphorus ion source/drain implantation regions of the n-channel metal-oxide-semiconductor field effect transistor (n-MOSFET) devices have been characterised using the Greek cross and Kelvin resistor test structures. From TSUPREM-4, the dose and energy of the phosphorus ion beam have been simulated to influence the sheet resistivity of the source/drain implantation regions. The secondary ion mass spectrometry (SIMS) measurement has verified the simulated surface concentration of the phosphorus ions. The measurements from the test structures have shown that the sheet resistivity and the specific interfacial contact resistivity of the source/drain terminals varied across the wafer. The influence of the heart size from the Greek cross structure and the contact area size from the Kelvin resistor structure have been investigated. In our application, the phosphorus ion dose of 1e16 ions/cm2 and energy of 40 keV have been measured to provide the desired small sheet resistivity of ps = 25.93 Ω/□. From the measured interfacial contact resistivity of pc∼10∼-4 Ωcm2, the interfacial contact area for the source/drain regions have been designed to be approximately 80 μm × 40 μm in order to achieve the reasonable interfacial contact resistance of Rc = 3 Ω. The fabrication design for the source/drain of the n-MOSFET devices is optimised in order to obtain good drain current conduction with small resistances. Penerbit Universiti, UTeM 2014-12 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/16843/2/JTEC2014.pdf Rhonira, Latif (2014) Characterisation Of Sheet Resistivity And Contact Resistivity For Source/Drain Of N-Mosfet Device. Journal Of Telecommunication, Electronic And Computer Engineering, 6 (2). pp. 29-36. ISSN 2180-1843 http://journal.utem.edu.my/index.php/jtec/article/view/464
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
topic T Technology (General)
spellingShingle T Technology (General)
Rhonira, Latif
Characterisation Of Sheet Resistivity And Contact Resistivity For Source/Drain Of N-Mosfet Device
description In this study, the sheet resistivity (ps) of the thin film phosphorus ion source/drain implantation regions, and the specific interfacial contact resistivity (pc) between the thin film aluminium 1% silicon electrode layer and the thin film phosphorus ion source/drain implantation regions of the n-channel metal-oxide-semiconductor field effect transistor (n-MOSFET) devices have been characterised using the Greek cross and Kelvin resistor test structures. From TSUPREM-4, the dose and energy of the phosphorus ion beam have been simulated to influence the sheet resistivity of the source/drain implantation regions. The secondary ion mass spectrometry (SIMS) measurement has verified the simulated surface concentration of the phosphorus ions. The measurements from the test structures have shown that the sheet resistivity and the specific interfacial contact resistivity of the source/drain terminals varied across the wafer. The influence of the heart size from the Greek cross structure and the contact area size from the Kelvin resistor structure have been investigated. In our application, the phosphorus ion dose of 1e16 ions/cm2 and energy of 40 keV have been measured to provide the desired small sheet resistivity of ps = 25.93 Ω/□. From the measured interfacial contact resistivity of pc∼10∼-4 Ωcm2, the interfacial contact area for the source/drain regions have been designed to be approximately 80 μm × 40 μm in order to achieve the reasonable interfacial contact resistance of Rc = 3 Ω. The fabrication design for the source/drain of the n-MOSFET devices is optimised in order to obtain good drain current conduction with small resistances.
format Article
author Rhonira, Latif
author_facet Rhonira, Latif
author_sort Rhonira, Latif
title Characterisation Of Sheet Resistivity And Contact Resistivity For Source/Drain Of N-Mosfet Device
title_short Characterisation Of Sheet Resistivity And Contact Resistivity For Source/Drain Of N-Mosfet Device
title_full Characterisation Of Sheet Resistivity And Contact Resistivity For Source/Drain Of N-Mosfet Device
title_fullStr Characterisation Of Sheet Resistivity And Contact Resistivity For Source/Drain Of N-Mosfet Device
title_full_unstemmed Characterisation Of Sheet Resistivity And Contact Resistivity For Source/Drain Of N-Mosfet Device
title_sort characterisation of sheet resistivity and contact resistivity for source/drain of n-mosfet device
publisher Penerbit Universiti, UTeM
publishDate 2014
url http://eprints.utem.edu.my/id/eprint/16843/2/JTEC2014.pdf
http://eprints.utem.edu.my/id/eprint/16843/
http://journal.utem.edu.my/index.php/jtec/article/view/464
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score 13.160551