The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging

The objectives of the project is to investigate the characteristics contact resistance of the silicon lead-frame interface using ECA die attach materials, and to evaluate the factors contributing to the increase of interface resistively in semiconductor packaging. This project was done at ON S...

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Bibliographic Details
Main Author: Chua, King Lee
Format: Thesis
Language:English
Published: 2004
Subjects:
Online Access:http://eprints.uthm.edu.my/7636/1/24p%20CHUA%20KING%20LEE.pdf
http://eprints.uthm.edu.my/7636/
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