Chipping free process for combination of narrow saw street (60UM) and thick wafer (600UM) sawing process

• Main Authors: Mohd Noh, Mohd Syahrin Amri, Liew, David, Harun, Fuaida
• Format: Conference or Workshop Item
• Language: English
• Published: 2010
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.utem.edu.my/id/eprint/15102/1/Chipping%20free%20process%20for%20combination%20of%20narrow%20saw%20street%20%2860um%29%20and%20thick%20wafer%20%28600um%29%20sawing%20process256.pdf; http://eprints.utem.edu.my/id/eprint/15102/

Chipping free is a dream for wafer sawing process. With current high complexity of wafer technology plus the drive for cost reduction by narrowing the saw street width, it is a challenge which requires huge effort for wafer sawing process to achieve chipping free process. Higher density of metalliza...