Chipping free process for combination of narrow saw street (60UM) and thick wafer (600UM) sawing process
Chipping free is a dream for wafer sawing process. With current high complexity of wafer technology plus the drive for cost reduction by narrowing the saw street width, it is a challenge which requires huge effort for wafer sawing process to achieve chipping free process. Higher density of metalliza...
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| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2010
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/15102/1/Chipping%20free%20process%20for%20combination%20of%20narrow%20saw%20street%20%2860um%29%20and%20thick%20wafer%20%28600um%29%20sawing%20process256.pdf http://eprints.utem.edu.my/id/eprint/15102/ |
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