Chipping free process for combination of narrow saw street (60UM) and thick wafer (600UM) sawing process

Chipping free is a dream for wafer sawing process. With current high complexity of wafer technology plus the drive for cost reduction by narrowing the saw street width, it is a challenge which requires huge effort for wafer sawing process to achieve chipping free process. Higher density of metalliza...

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Bibliographic Details
Main Authors: Mohd Noh, Mohd Syahrin Amri, Liew, David, Harun, Fuaida
Format: Conference or Workshop Item
Language:English
Published: 2010
Subjects:
Online Access:http://eprints.utem.edu.my/id/eprint/15102/1/Chipping%20free%20process%20for%20combination%20of%20narrow%20saw%20street%20%2860um%29%20and%20thick%20wafer%20%28600um%29%20sawing%20process256.pdf
http://eprints.utem.edu.my/id/eprint/15102/
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