Investigation of Intermetallic Phase Formation and Structural Analysis in Annealed Al/Cu Bilayer Thin Films.
The growth of intermetallic phases in Al/Cu bilayers thin film having 2/3 layer thickness ratios were characterized by X-ray powder diffraction (XRD), energy dispersive X-ray (EDX) and transmission electron microscopy (TEM). In annealing temperature of 200 oC, the growth is controlled by Cu diffusio...
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Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
2014
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Subjects: | |
Online Access: | http://eprints.utem.edu.my/id/eprint/10970/1/AMR.845.221_Azizi.pdf http://eprints.utem.edu.my/id/eprint/10970/ |
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Summary: | The growth of intermetallic phases in Al/Cu bilayers thin film having 2/3 layer thickness ratios were characterized by X-ray powder diffraction (XRD), energy dispersive X-ray (EDX) and transmission electron microscopy (TEM). In annealing temperature of 200 oC, the growth is controlled by Cu diffusion which resulted to formation of θ- Al2Cu, η- AlCu, ζ- Al3Cu4 and γ-Al4Cu9 phase. |
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