Structural Analysis Of Stretchable Electronics Joint Under Tensile And Vibration Loading
Solder joint is the major part of electronic devices to form an electrical connection and mechanical bond. Thus, study of electronics joint reliability is significant to determine the ability of the interconnection to maintain its functionality under subjected environments. Reliability of electronic...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2017
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| Online Access: | http://eprints.usm.my/54406/1/Structural%20Analysis%20Of%20Stretchable%20Electronics%20Joint%20Under%20Tensile%20And%20Vibration%20Loading_Nadirah%20Mustaffa_M4_2017.pdf http://eprints.usm.my/54406/ |
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