Structural And Reliability Analysis Of Solder Joint Under Vibration Loading
Most of the devices nowadays contained electronic parts and often operated in a vibration environment for extended periods without failing. The role of solder in electronic packages has expanded and act as electrical interconnection as well as mechanical bond to certain parts while the joint decreas...
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| Main Author: | |
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| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2019
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| Online Access: | http://eprints.usm.my/58469/1/Structural%20And%20Reliability%20Analysis%20Of%20Solder%20Joint%20Under%20Vibration%20Loading.pdf http://eprints.usm.my/58469/ |
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